HDI PCB

Layer count: 10 
Material: FR4 ,1.6mm, TG 180, 1 OZ  for all layer
Minimum tack: 3mil
Minimum space(gap): 3mil
Minimum hole: 0.1mm
Surface finished: ENIG
Panel size: 390*368mm/4up
Characteristics: high density interconnect PCB,via on pad(plug with resin,and plate copper flat), high TG
Application：smart phone, cell phone, mobile

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