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Circuit Feature

Production(um) Advanced(um) Future(um)

Through Via Size (Drill Diameter)

200 200 200

Pad over drill size-inner layer

125 100 100

Pad over drill size-outer layer

125 100 100

Maximum Aspect Ratio

8:1 10:1 12:1

Plated via Diameter Tolerance

+/-76 +/-50 +/-50

Solder mask Registration Tolerance

+/-76 +/-50 +/-25

Layer to layer Registration Tolerance

+/-100 +/-76 +/-76
Layer count maximum 8 10~12 14~16

Panel size maximum (in mm)

550X1500 550X1500 550X1500

Inner layer L/S minimum (0.5oz copper)

100/100 76/76 76/76

Inner layer L/S Tolerance (0.5oz copper)

+/-20 +/-15 +/-15

Inner layer L/S minimum (1.0oz copper)

125 100 76/100

Inner layer L/S Tolerance (1.0oz copper)

+/-25 +/-20 +/-15

Outer layer L/S minimum (0.5oz copper)

100/100 80/80 76/76

Outer layer L/S Tolerance (0.5oz copper)

+/-25 +/-20 +/-15

Outer layer L/S minimum (1.0oz copper)

125/125 100/100 76/76

Outer layer L/S Tolerance (1.0oz copper)

+/-25 +/-20 +/-20

Routed feature Tolerance (profile tolerance)

+/-125 +/-100 +/-50

Board thickness minimum (in mm)

0.3 0.2 0.15

Board thickness maximum (in mm)

2.5 3.2 4.0

Impedance control

+/-10% +/-8% +/-8%

Laminate Materials




FR4;Tg135,Tg150,Tg170

Yes Yes Yes

Cem-3

Yes Yes Yes

Ceramic

Yes Yes Yes

Aluminum Substrate

Yes Yes Yes

Rogers R4233,R4003

Yes Yes Yes

IS410,IS680

Yes Yes Yes

Blind and buried hole




Minimum blind hole

0.2 / /

Blind hole layer/level

2 3 4

Mininum buried hole

0.2 / /

Buried hole layer/level

1 / /

Via-plugged (by epoxy)

0.2-1.2 / /

Via-plugged (by solder resist ink)

0.2-0.6 / /

Minimum drill hole size (Mechanical drilling)

0.2 / /

Laser drilling (not in production currently.

Outsourcing is available if necessary)

/ / /


Lead time

1L 2L 4L 6L 8L

Sample/small batch

1-3day 1-5day 1-7day 2-7day 2-8day

Medium batch

3-8day 3-8day 4-12day 4-12day 4-12day


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